BGA Reballing Stencil For Drone CPU for DJI Drone Spark/Mavic/Phantom/Inspire

Description

0.12mm multifunctional BGA reballing stencil for Drone motherboard CPU repair, UAV Motherboard BGA Reballing Stencil For DJI Spark/Mavic/Phantom/Inspire series drone repair, high-quality steel sheet stencil repair damaged Drone by reballing CPU. Super-hard high-precision drone reballing stencil for different drone motherboard CPU models. Professional Drone repair tools.
0.12MM Comprehensive UAV Motherboard CPU BGA Reballing Stencil For Drone Repair
Model:
UAV 1:
AR9342, B8132B4PM-1D-F, LF-2100E, BGA 221, BGA 153, iE1000, SMB1351, H6, H3, LC1860C, 85331-11, ACPD4G31D3, MA2100A MA2155, LCMX02, LC1160, S1, DSPIC33
UAV 2:
BGA 96, BGA 60, BGA 200, BGA 84, BGA 178, A9-A1-RH, DM365ZCE30, ATSAME70Q21, BGA 63, STM32F, ATSAME70N19
Features:
1. high quality stainless steel sheet
2. high-precision
3. High temperature resistance
4. No deformation
5. Good flatness
Why do we need a specific BGA reballing stencil for Drone motherboard repair?
As we know,  when a drone has a problem with no image transmission (Wireless HD Video Transmission) or a frequency pairing error, it's very expensive to repair the drone by replacing the core motherboard.
Actually, these problems are mostly caused by the broken CPU pins of the drone, we just need to disassemble the CPU and reballing it.
However, there are hundreds of CPU pins, so it's important to use a professional BGA reballing stencil for Drone repair.
This BGA reballing stencil is suitable for DJI Drone Spark/Mavic/Phantom/Inspire series, with these two pieces of BGA reballing stencil, can solve more than 95% of the UAV motherboard  BGA chip problems on the market.