-40%

BGA Reballing Stencil Template Kit Platform For CPU MSM8953 8994/8956/8974 etc

$ 36.95

Availability: 10 in stock
  • Condition: New
  • Brand: Unbranded
  • MPN: Does Not Apply
  • All returns accepted: Returns Accepted
  • Restocking Fee: No
  • Item must be returned within: 30 Days
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back

    Description

    AMAOE MBGA-B6 planting tin platform/Android phone CPU/ planting tin/glue removal/positioning board /CPU steel mesh
    Pacakge including:
    7x stencils
    2x Tin scraping blade
    6x Adjusting plate
    1x Mbga-B6 Positioning plate
    1x  Ubase