BGA Rebelling Stencil Kit Set Solder Template IC Power Chip For Huawei Xiaomi

Description

BGA Rebelling Stencil Kit Set Solder Template IC Power Chip For Huawei Xiaomi
Description
Model Number: BGA Reballing Stencil Kits
Particle Size: 1-10μm
Application: For HUAWEI BGA Reballing Stencil Kits
Application 2: For XIAOMI BGA Reballing Stencil Kits
Application 3: For OPPO BGA Reballing Stencil Kits
Application 4: For Meizu BGA Reballing Stencil Kits
Application 5: For LG BGA Reballing Stencil Kits
Application 6: For Samsung MTK BGA Reballing Stencil Kits
Application 7: For ic power BGA