MECHANIC 3D BGA Reballing Fixture for iPhone 12 12Pro PCB BGA Planting Platform

Description

Description :
Mechanic 3D-12Pro A/B middle frame BGA reballing stencil template for iPhone 12/12 Pro BGA PCB soldering repair, iPhone 12/12 Pro A/B middle frame reballing platform for i[Phone motherboard repair.
Product Features :
1. 3D groove etching process: Universal material thickness 0.3mm groove etching thickness 0.15, reballing thickness 0.15mm. 2. Take off the stencil to planting, prevent stencil from bulging.
3. Square hole for planting stencil: The distance is exactly the same, and planting balls better.
4. Round and full as a pearl: The tin ball bright, full and uniform.
5. Imported with original packaging: Original imported T0.12AAA level material, good toughness, strong hardness, high temperature resistance 585℃, no bulge, high flatness, not easy to deformation.
6. Double-sided positioning design: Tin planting on the upper and lower layers of the main board, degumming
Product Specification :
Item Name: 3D-12Pro Reballing Stencil
Brand: Mechanic
Model: 3D-12Pro (12 Pro A/B)
Product Size: 77*35*0.12mm
Packing Size: 95*63*14mm
Net Weight: 6g